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| VSM1506 Vishay Foil Resistors SURFACE MOUNT Bulk Metal(R) Foil Technology Discrete High Precision Surface Mount Chip Resistor FEATURES * High Precision, Low TCR * Temperature Coefficient of Resistance: Nominal TCR: + 0.6ppm/C (0C to + 25C) - 0.6ppm/C (+ 25C to + 60C) + 2.2ppm/C (- 55C to + 25C) - 1.8ppm/C (+ 25C to + 125C) * Resistance Range: 10 to 40K * Tolerance: to 0.01% (See table 1) * Load Life Stability: 0.01% maximum R under full rated power @ + 70C for 2000 hours. * Shelf Life Stability: 50ppm/year (0.005%) maximum R non-hermetically sealed * Voltage Coefficient: < 0.00001%/volt (< 0.1ppm/V) * Current Noise: < 0.010V(rms)/volt of applied voltage * Non Inductive: < 3.0nH * Terminal Finishes Available: Lead (Pb)-free (Sn 99.3% Cu 0.7%) Tin/Lead Alloy (Sn 62% Pb 36% Ag 2%) Product may not be to scale The VSM1506 Discrete Precision Chip Resistor uses the Bulk Metal(R) Foil (BMF) Technology for the resistance element. The BMF provides inherently a low and predictable temperature coefficient of resistance (TCR) and remarkable load life stability for precision analog applications. The predictable TCR variation is independent of value, date code, time and is expressed via the curve shown below. The VSM1506 has a newly designed, robust termination which insures safe handling during the manufacturing process as well as providing stability during the multiple thermal cyclings it will see over its service life. The load life specification has been improved providing even greater life stability and the ohmic value has been extended from 33K to 40K Ohms. A voltage divider can be fashioned by using two arbitrarily selected VSM1506s; with a resultant tracking specification of < 3ppm/C. The VSM1506 replaces the VSM1505 for new designs. TABLE 1 - TOLERANCE VERSUS RESISTANCE VALUE VALUE () 100 to 40K 50 to < 100 25 to < 50 STANDARD TOLERANCE* (%) 0.01 0.05 0.1 10 to < 25 0.25 *Tighter tolerances are available. Please contact Application Engineering. Soldering temperatures used during installation may cause resistance to shift up to 0.01%. FIGURE 1 - NOMINAL TCR CURVE -55 -50 +500 +400 +300 +200 +100 -25 0 TABLE 2 - TYPICAL PERFORMANCE SPECIFICATIONS TEST MIL-PRF-55342G CHARACTERISTIC E R LIMITS 0.10% 0.10% 0.10% 0.10% 0.20% 0.20% 0.50% 100 63 12 VSM1506 MAXIMUM R LIMITS* 0.02% 0.02% 0.02% 0.03% 0.01% 0.03% 0.01% +25 +50 +75 +100 +125 -5 +5 pp m pp m Thermal Shock Low Temperature Operation Short Time Overload High Temperature Exposure Resistance to Bonding Moisture Resistance Life 2000 hours @ + 70C Power @ + 70C (mW) Nominal Resistance/ Temperature (RT) Curve R R (ppm) 0 -100 -200 -300 -400 -500 Maximum Spread 2.3 ppm/C +2.2 ppm/C Nominal Chord Slope (TCR) -1.8 ppm/C Nominal Chord Slope (TCR) Standard Spread 2.0 ppm/C -55C / +25C / +125C are the test points with +25C as the reference temperature The TCR for values < 100 are influenced by the termination composition and result in a deviation from this curve. Contact our application engineering department for detailed specification on low values Maximum Voltage (V) Maximum Weight (mg) *As shown + 0.01 Ohms to allow for measurement errors at low values. SALES * ISRAEL: foilsales.israel@vishay.com * FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com * AMERICAS: foilsales.usa@vishay.com * ASIA/JAPAN: foilsales.asia@vishay.com * UK/HOLLAND/SCANDANAVIA: foilsales.eunorth@vishay.com * GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com www.vishay.com 24 For technical questions in the Americas, contact foilsupport1@vishay.com Document Number: 63071 For technical questions in Asia/Japan/Europe/Africa/Israel, contact foilsupport2@vishay.com Revision 17-Aug-04 VSM1506 Bulk Metal Foil Technology Vishay Foil Resistors Discrete High Precision Surface Mount Chip Resistor (R) SURFACE MOUNT FIGURE 2 - DERATING CURVE FIGURE 3 - RECOMMENDED MOUNTING Percent of Rated Power 125 100 -55C +70C Rated Power 25% to 85% of T 75 50 25 0 -75 -50 -25 0 +25 +50 +75 +100 +125 +150 +175 Ambient Temperature (C) A low profile solder fillet is recommended to avoid unnecessary stresses along top edge of metallization. IR and vapor phase reflow are best. Avoid the use of cleaning agents which could attack epoxy resins, which form part of the resistor construction. TABLE 3 - CHIP SIZES AND SPECIFICATIONS in inches (millimeters) Bottom View for Mounting Uncoated Ceramic L X T D W G Z Footprint Recommended Land Pattern L W 0.005 [0.13] 0.150 [3.81] 0.005 [0.13] 0.062 [1.57] T MAXIMUM 0.025 [0.64] D 0.005 [0.13] 0.020 [0.50] Z* MAXIMUM 0.199 [5.046] G* MINIMUM 0.083 [2.108] X* MAXIMUM 0.071 [1.806] *Land Pattern Dimensions are per IPC-782 TABLE 4 - ORDERING INFORMATION MODEL VSM CHIP SIZE 1506 RESISTANCE RANGE RESISTANCE VALUE LETTER DESIGNATOR MULTIPLIER FACTOR x 1.0 TOLERANCE T 0.01% Q 0.02% A 0.05% B 0.1% C 0.25% D 0.5% F 1.0% TERMINATION S - Lead (Pb)-free B - Tin/Lead PACKAGING T = Tape and Reel W = Waffle Pack 5 to < 1K R Example: 249R00 = 249 1K to 40K K x 103 Example: 10K000 = 10.0K SALES * ISRAEL: foilsales.israel@vishay.com * FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com * AMERICAS: foilsales.usa@vishay.com * ASIA/JAPAN: foilsales.asia@vishay.com * UK/HOLLAND/SCANDANAVIA: foilsales.eunorth@vishay.com * GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com For technical questions in the Americas, contact foilsupport1@vishay.com Document Number: 63071 For technical questions in Asia/Japan/Europe/Africa/Israel, contact foilsupport2@vishay.com Revision 17-Aug-04 www.vishay.com 25 |
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